IP Library Granted Patent US 6,575,765
Granted Patent Utility
US 6,575,765 · App. 09/777,638

Interconnect assembly for an electronic assembly and assembly method therefor

Inventor: Erich W. Gerbsch
Patented Case View Patent ↗
Granted: Jun 10, 2003 Filed: Feb 5, 2001
Inventor
Erich W. Gerbsch
Assignee (at issue)
Delphi Technologies

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Quick Facts
Patent No.
US 6,575,765
App. No.
09/777,638
Filed
2001-02-05
Granted
2003-06-10
Kind
B2