Granted Patent
Utility
US 6,575,823 · App. 10/077,709
Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
Inventors:
Yaw S. Obeng, Edward M. Yokley
Patented Case
View Patent ↗
Granted: Jun 10, 2003
Filed: Mar 4, 2002
Inventors
Yaw S. Obeng
Edward M. Yokley
Assignee (at issue)
PsiloQuest
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.