Granted Patent
Utility
US 6,576,995 · App. 09/832,246
Housing for semiconductor chips
Inventors:
Jürgen Högerl, Stefan Paulus
Patented Case
View Patent ↗
Granted: Jun 10, 2003
Filed: Apr 10, 2001
Inventors
Jürgen Högerl
Stefan Paulus
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.