Granted Patent
Utility
US 6,576,998 · App. 10/086,293
Thin semiconductor package with semiconductor chip and electronic discrete device
Inventor:
Paul R. Hoffman
Patented Case
View Patent ↗
Granted: Jun 10, 2003
Filed: Feb 28, 2002
Inventor
Paul R. Hoffman
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.