Granted Patent
Utility
US 6,579,591 · App. 09/885,353
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
Inventors:
Craig V. Bishop, George Bokisa, Robert Jeffrey Durante, John R. Kochilla
Patented Case
View Patent ↗
Granted: Jun 17, 2003
Filed: Jul 17, 2001
Inventors
Craig V. Bishop
George Bokisa
Robert Jeffrey Durante
John R. Kochilla
Assignee (at issue)
Atotech Deutschland GmbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.