Granted Patent
Utility
US 6,579,746 · App. 09/932,080
Method and apparatus for coupling a semiconductor die to die terminals
Inventors:
Aaron Schoenfeld, Manny K. F. Ma, Larry D. Kinsman, J. Mike Brooks, Timothy J. Allen
Patented Case
View Patent ↗
Granted: Jun 17, 2003
Filed: Aug 17, 2001
Inventors
Aaron Schoenfeld
Manny K. F. Ma
Larry D. Kinsman
J. Mike Brooks
Timothy J. Allen
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.