Granted Patent
Utility
US 6,580,159 · App. 09/434,589
Integrated circuit device packages and substrates for making the packages
Inventors:
James Fusaro, Robert Francis Darveaux, Pablo Rodriguez
Patented Case
View Patent ↗
Granted: Jun 17, 2003
Filed: Nov 5, 1999
Inventors
James Fusaro
Robert Francis Darveaux
Pablo Rodriguez
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.