Granted Patent
Utility
US 6,582,990 · App. 10/225,399
Wafer level underfill and interconnect process
Inventor:
Martin Standing
Patented Case
View Patent ↗
Granted: Jun 24, 2003
Filed: Aug 20, 2002
Inventor
Martin Standing
Assignee (at issue)
International Rectifier Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.