Granted Patent
Utility
US 6,582,992 · App. 10/222,294
Stackable semiconductor package and wafer level fabrication method
Inventors:
Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang
Patented Case
View Patent ↗
Granted: Jun 24, 2003
Filed: Aug 15, 2002
Inventors
Chia Yong Poo
Boon Suan Jeung
Low Siu Waf
Chan Min Yu
Neo Yong Loo
Chua Swee Kwang
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.