Granted Patent
Utility
US 6,583,050 · App. 10/218,006
Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer
Inventors:
Guido Wenski, Thomas Altmann, Ernst Feuchtinger, Willibald Bernwinkler, Wolfgang Winkler, Gerhard Heier
Patented Case
View Patent ↗
Granted: Jun 24, 2003
Filed: Aug 13, 2002
Inventors
Guido Wenski
Thomas Altmann
Ernst Feuchtinger
Willibald Bernwinkler
Wolfgang Winkler
Gerhard Heier
Assignee (at issue)
Wacker Siltronic Gesellschaft F{dot over (u)}r Halbleitermaterialien AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.