Granted Patent
Utility
US 6,583,364 · App. 09/642,638
Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
Inventors:
Hideyuki Kurita, Masanao Watanabe, Masayuki Nakamura, Mitsuhiro Fukuda, Hiroyuki Usui
Patented Case
View Patent ↗
Granted: Jun 24, 2003
Filed: Aug 22, 2000
Inventors
Hideyuki Kurita
Masanao Watanabe
Masayuki Nakamura
Mitsuhiro Fukuda
Hiroyuki Usui
Assignee (at issue)
Sony Chemicals Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.