Granted Patent
Utility
US 6,583,388 · App. 10/010,931
High thermal efficiency, small form-factor packages including thermally insulative cavities, and transfer molded variants
Inventors:
Douglas E. Crafts, David J. Chapman, Steven M. Swain
Patented Case
View Patent ↗
Granted: Jun 24, 2003
Filed: Nov 13, 2001
Inventors
Douglas E. Crafts
David J. Chapman
Steven M. Swain
Assignee (at issue)
JDS Uniphase Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.