Granted Patent
Utility
US 6,583,517 · App. 10/119,491
Method and structure for joining two substrates with a low melt solder joint
Inventor:
Miguel A. Jimarez
Patented Case
View Patent ↗
Granted: Jun 24, 2003
Filed: Apr 9, 2002
Inventor
Miguel A. Jimarez
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.