Granted Patent
Utility
US 6,586,277 · App. 09/681,839
Method and structure for manufacturing improved yield semiconductor packaged devices
Inventor:
Tongbi Jiang
Patented Case
View Patent ↗
Granted: Jul 1, 2003
Filed: Jul 26, 2001
Inventor
Tongbi Jiang
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.