Granted Patent
Utility
US 6,586,677 · App. 09/863,359
Plastic integrated circuit device package having exposed lead surface
Inventor:
Thomas P. Glenn
Patented Case
View Patent ↗
Granted: Jul 1, 2003
Filed: May 22, 2001
Inventor
Thomas P. Glenn
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.