Granted Patent
Utility
US 6,586,823 · App. 10/127,759
Semiconductor device that can have a defective bit found during or after packaging process repaired
Inventors:
Ryuji Ohmura, Kazushi Sugiura
Patented Case
View Patent ↗
Granted: Jul 1, 2003
Filed: Apr 23, 2002
Inventors
Ryuji Ohmura
Kazushi Sugiura
Assignees (at issue)
MITSUBISHI ELECTRIC CORPORATION
Ryoden Semiconductor System Engineering Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.