Granted Patent
Utility
US 6,586,834 · App. 10/171,694
Die-up tape ball grid array package
Inventors:
Ming Wang Sze, Kwok Cheung Tsang, Wing Keung Lam, Kin-wai Wong
Patented Case
View Patent ↗
Granted: Jul 1, 2003
Filed: Jun 17, 2002
Inventors
Ming Wang Sze
Kwok Cheung Tsang
Wing Keung Lam
Kin-wai Wong
Assignee (at issue)
A-SAT CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.