Granted Patent
Utility
US 6,586,836 · App. 09/516,652
Process for forming microelectronic packages and intermediate structures formed therewith
Inventors:
Qing Ma, Xiao-Chun Mu, Quat Vu, Steve Towle
Patented Case
View Patent ↗
Granted: Jul 1, 2003
Filed: Mar 1, 2000
Inventors
Qing Ma
Xiao-Chun Mu
Quat Vu
Steve Towle
Assignee (at issue)
Intel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.