Granted Patent
Utility
US 6,588,098 · App. 09/710,786
Method for manufacturing an electronic device package
Inventors:
Boon Huat Lim, Saat Shukri Embong, Kevin John Theseira, Kenneth Teik Kheong Low
Patented Case
View Patent ↗
Granted: Jul 8, 2003
Filed: Nov 13, 2000
Inventors
Boon Huat Lim
Saat Shukri Embong
Kevin John Theseira
Kenneth Teik Kheong Low
Assignee (at issue)
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.