Granted Patent
Utility
US 6,589,801 · App. 09/385,694
Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques
Inventors:
Ju Hoon Yoon, Dae Byung Kang, In Bae Park, Vincent DiCaprio, Markus K. Liebhard
Patented Case
View Patent ↗
Granted: Jul 8, 2003
Filed: Aug 30, 1999
Inventors
Ju Hoon Yoon
Dae Byung Kang
In Bae Park
Vincent DiCaprio
Markus K. Liebhard
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.