Granted Patent
Utility
US 6,589,810 · App. 09/546,706
BGA package and method of fabrication
Inventor:
Walter L. Moden
Patented Case
View Patent ↗
Granted: Jul 8, 2003
Filed: Apr 10, 2000
Inventor
Walter L. Moden
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.