Granted Patent
Utility
US 6,590,274 · App. 09/916,320
Semiconductor wafer and method for manufacturing semiconductor devices
Inventors:
Takashi Ohsumi, Yuzo Kato
Patented Case
View Patent ↗
Granted: Jul 8, 2003
Filed: Jul 30, 2001
Inventors
Takashi Ohsumi
Yuzo Kato
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.