Granted Patent
Utility
US 6,593,241 · App. 09/075,854
Method of planarizing a semiconductor device using a high density plasma system
Inventors:
Thomas Abraham, James A. Bondur, James P. Garcia
Patented Case
View Patent ↗
Granted: Jul 15, 2003
Filed: May 11, 1998
Inventors
Thomas Abraham
James A. Bondur
James P. Garcia
Assignee (at issue)
Applied Materials, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.