Granted Patent
Utility
US 6,593,545 · App. 09/929,428
Laser defined pads for flip chip on leadframe package fabrication method
Inventors:
Jonathon G. Greenwood, Frank J. Juskey
Patented Case
View Patent ↗
Granted: Jul 15, 2003
Filed: Aug 13, 2001
Inventors
Jonathon G. Greenwood
Frank J. Juskey
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.