Granted Patent
Utility
US 6,596,621 · App. 10/151,075
Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate
Inventors:
Bruce Anthony Copeland, Rebecca Y. Gorrell, Mark A. Takacs, Kenneth J. Travis, Jr., Jun Wang, Lovell B. Wiggins
Patented Case
View Patent ↗
Granted: Jul 22, 2003
Filed: May 17, 2002
Inventors
Bruce Anthony Copeland
Rebecca Y. Gorrell
Mark A. Takacs
Kenneth J. Travis, Jr.
Jun Wang
Lovell B. Wiggins
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.