Granted Patent
Utility
US 6,596,639 · App. 09/415,529
Method for chemical/mechanical planarization of a semiconductor wafer having dissimilar metal pattern densities
Inventors:
William Easter, Sudhanshu Misra, Vivek Saxena
Patented Case
View Patent ↗
Granted: Jul 22, 2003
Filed: Oct 8, 1999
Inventors
William Easter
Sudhanshu Misra
Vivek Saxena
Assignee (at issue)
Agere Systems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.