Granted Patent
Utility
US 6,602,738 · App. 10/241,294
Method of manufacturing semiconductor device having tie bars for interconnecting leads
Inventors:
Zhikang Qin, Namiki Moriga
Patented Case
View Patent ↗
Granted: Aug 5, 2003
Filed: Sep 12, 2002
Inventors
Zhikang Qin
Namiki Moriga
Assignee (at issue)
MITSUBISHI ELECTRIC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.