Granted Patent
Utility
US 6,602,790 · App. 10/008,808
Method for patterning a multilayered conductor/substrate structure
Inventors:
Kouroche Kian, Ramin Heydarpour
Patented Case
View Patent ↗
Granted: Aug 5, 2003
Filed: Nov 13, 2001
Inventors
Kouroche Kian
Ramin Heydarpour
Assignee (at issue)
Avery Dennison Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.