Granted Patent
Utility
US 6,603,072 · App. 09/828,046
Making leadframe semiconductor packages with stacked dies and interconnecting interposer
Inventors:
Donald C. Foster, David Zoba
Patented Case
View Patent ↗
Granted: Aug 5, 2003
Filed: Apr 6, 2001
Inventors
Donald C. Foster
David Zoba
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.