Granted Patent
Utility
US 6,603,203 · App. 09/902,608
Semiconductor device having capacitive element structure and multilevel interconnection structure and method of fabricating the same
Inventor:
Kazushi Amanuma
Patented Case
View Patent ↗
Granted: Aug 5, 2003
Filed: Jul 12, 2001
Inventor
Kazushi Amanuma
Assignee (at issue)
NEC Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.