Granted Patent
Utility
US 6,605,528 · App. 10/004,027
Post passivation metal scheme for high-performance integrated circuit devices
Inventors:
Mou-Shiung Lin, Ming-Ta Lei, Jin-Yuan Lee, Ching-Cheng Huang
Patented Case
View Patent ↗
Granted: Aug 12, 2003
Filed: Oct 24, 2001
Inventors
Mou-Shiung Lin
Ming-Ta Lei
Jin-Yuan Lee
Ching-Cheng Huang
Assignee (at issue)
Megica Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.