Granted Patent
Utility
US 6,605,865 · App. 09/998,844
Semiconductor package with optimized leadframe bonding strength
Inventors:
Jung Ho Jeong, Jong-Chul Hong, Eun-Deok Kim
Patented Case
View Patent ↗
Granted: Aug 12, 2003
Filed: Oct 19, 2001
Inventors
Jung Ho Jeong
Jong-Chul Hong
Eun-Deok Kim
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.