Granted Patent
Utility
US 6,608,340 · App. 09/821,853
Substrate assembly having a depression suitable for an integrated circuit configuration and method for its fabrication
Inventors:
Franz Hofmann, Till Schlösser, Josef Willer
Patented Case
View Patent ↗
Granted: Aug 19, 2003
Filed: Mar 30, 2001
Inventors
Franz Hofmann
Till Schlösser
Josef Willer
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.