Granted Patent
Utility
US 6,608,686 · App. 10/022,035
Measurement of metal electroplating and seed layer thickness and profile
Inventors:
Lawrence Lane, Nickhil Jakatdar, Xinhui Niu
Patented Case
View Patent ↗
Granted: Aug 19, 2003
Filed: Dec 13, 2001
Inventors
Lawrence Lane
Nickhil Jakatdar
Xinhui Niu
Assignee (at issue)
TIMBRE TECHNOLOGIES, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.