Granted Patent
Utility
US 6,609,652 · App. 09/962,007
Ball bumping substrates, particuarly wafers
Inventors:
John MacKay, Tom Molinaro
Patented Case
View Patent ↗
Granted: Aug 26, 2003
Filed: Sep 24, 2001
Inventors
John MacKay
Tom Molinaro
Assignee (at issue)
Spheretek, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.