Granted Patent
Utility
US 6,609,957 · App. 09/854,245
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
Inventors:
Dinesh Chopra, Scott Meikle
Patented Case
View Patent ↗
Granted: Aug 26, 2003
Filed: May 11, 2001
Inventors
Dinesh Chopra
Scott Meikle
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.