Granted Patent
Utility
US 6,617,699 · App. 09/997,844
120 degree bump placement layout for an integrated circuit power grid
Inventors:
Sudhakar Bobba, Tyler Thorp, Dean Liu
Patented Case
View Patent ↗
Granted: Sep 9, 2003
Filed: Nov 29, 2001
Inventors
Sudhakar Bobba
Tyler Thorp
Dean Liu
Assignee (at issue)
Sun Microsystems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.