IP Library Granted Patent US 6,620,862
Granted Patent Utility
US 6,620,862 · App. 09/851,564

Sheet resin composition and process for manufacturing semiconductor device therewith

Inventors: Hirotaka Ueda, Masaki Mizutani
Patented Case View Patent ↗
Granted: Sep 16, 2003 Filed: May 8, 2001
Inventors
Hirotaka Ueda
Masaki Mizutani
Assignees (at issue)
Amkor Technology, Inc.
NITTO DENKO CORPORATION

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Quick Facts
Patent No.
US 6,620,862
App. No.
09/851,564
Filed
2001-05-08
Granted
2003-09-16
Kind
B2