Granted Patent
Utility
US 6,624,042 · App. 09/893,352
Fabrication process for a semiconductor component
Inventor:
Uwe Schilling
Patented Case
View Patent ↗
Granted: Sep 23, 2003
Filed: Jun 27, 2001
Inventor
Uwe Schilling
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.