Granted Patent
Utility
US 6,624,059 · App. 10/197,271
Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond
Inventor:
Michael B. Ball
Patented Case
View Patent ↗
Granted: Sep 23, 2003
Filed: Jul 15, 2002
Inventor
Michael B. Ball
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.