Granted Patent
Utility
US 6,629,633 · App. 09/711,994
Chip size image sensor bumped package fabrication method
Inventors:
Thomas P. Glenn, Steven Webster, Markus K. Liebhard
Patented Case
View Patent ↗
Granted: Oct 7, 2003
Filed: Nov 13, 2000
Inventors
Thomas P. Glenn
Steven Webster
Markus K. Liebhard
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.