Granted Patent
Utility
US 6,642,136 · App. 09/953,525
Method of making a low fabrication cost, high performance, high reliability chip scale package
Inventors:
Jin-Yuan Lee, Ming-Ta Lei, Ching-Cheng Huang, Chuen-Jye Lin
Patented Case
View Patent ↗
Granted: Nov 4, 2003
Filed: Sep 17, 2001
Inventors
Jin-Yuan Lee
Ming-Ta Lei
Ching-Cheng Huang
Chuen-Jye Lin
Assignee (at issue)
Megica Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.