Granted Patent
Utility
US 6,642,145 · App. 10/226,520
Method of manufacturing an integrated circuit with a dielectric diffusion barrier layer formed between interconnects and interlayer dielectric layers
Inventors:
Steven C. Avanzino, Pin-Chin Connie Wang, Minh Van Ngo
Patented Case
View Patent ↗
Granted: Nov 4, 2003
Filed: Aug 22, 2002
Inventors
Steven C. Avanzino
Pin-Chin Connie Wang
Minh Van Ngo
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.