Granted Patent
Utility
US 6,642,610 · App. 09/745,265
Wire bonding method and semiconductor package manufactured using the same
Inventors:
Young-Kuk Park, Byung Joon Han, Jae Dong Kim
Patented Case
View Patent ↗
Granted: Nov 4, 2003
Filed: Dec 20, 2000
Inventors
Young-Kuk Park
Byung Joon Han
Jae Dong Kim
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.