Granted Patent
Utility
US 6,645,792 · App. 10/011,704
Lead frame and method for fabricating resin-encapsulated semiconductor device
Inventors:
Akira Oga, Hisaho Inao, Hiroshi Hidaka
Patented Case
View Patent ↗
Granted: Nov 11, 2003
Filed: Dec 11, 2001
Inventors
Akira Oga
Hisaho Inao
Hiroshi Hidaka
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.