IP Library Granted Patent US 6,645,862
Granted Patent Utility
US 6,645,862 · App. 09/989,550

Double-side polishing process with reduced scratch rate and device for carrying out the process

Inventors: Guido Wenski, Johann Glas, Thomas Altmann, Gerhard Heier
Patented Case View Patent ↗
Granted: Nov 11, 2003 Filed: Nov 20, 2001
Inventors
Guido Wenski
Johann Glas
Thomas Altmann
Gerhard Heier
Assignee (at issue)
Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG

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Quick Facts
Patent No.
US 6,645,862
App. No.
09/989,550
Filed
2001-11-20
Granted
2003-11-11
Kind
B2