Granted Patent
Utility
US 6,646,339 · App. 09/687,787
Thin and heat radiant semiconductor package and method for manufacturing
Inventors:
Jae Hun Ku, Jae Hak Yee
Patented Case
View Patent ↗
Granted: Nov 11, 2003
Filed: Oct 13, 2000
Inventors
Jae Hun Ku
Jae Hak Yee
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.