Granted Patent
Utility
US 6,646,355 · App. 10/036,462
Structure comprising beam leads bonded with electrically conductive adhesive
Inventors:
Sung Kwon Kang, Sampath Purushothaman
Patented Case
View Patent ↗
Granted: Nov 11, 2003
Filed: Jan 7, 2002
Inventors
Sung Kwon Kang
Sampath Purushothaman
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.