Granted Patent
Utility
US 6,647,620 · App. 09/680,473
Method of making center bond flip chip semiconductor carrier
Inventors:
Tongbi Jiang, Alan G. Wood
Patented Case
View Patent ↗
Granted: Nov 18, 2003
Filed: Oct 6, 2000
Inventors
Tongbi Jiang
Alan G. Wood
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.