Granted Patent
Utility
US 6,649,448 · App. 09/961,368
Method of manufacturing a semiconductor device having flexible wiring substrate
Inventor:
Seiichi Tomihara
Patented Case
View Patent ↗
Granted: Nov 18, 2003
Filed: Sep 25, 2001
Inventor
Seiichi Tomihara
Assignees (at issue)
HITACHI, LTD.
Hitachi Hokkai Semiconductor Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.